US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,882, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Jaemok Jung (Suwon-si, South Korea), Dowan Kim (Suwon-si, South Korea), Sungkeun Park (Suwon-si, South Korea), Jongho Park (Suwon-si, South Korea) and Juil Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution wiring layer having a first region and a second region surrounding the first region, a semiconductor chip disposed on the first region of the first redistribution wiring layer, a seali...