US Patent Issued to Infineon Technologies on Nov. 3 for "3D-IC for RF applications" (German Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,881, issued on Nov. 3, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"3D-IC for RF applications" was invented by Hans Taddiken (Munich), Christoph Kadow (Gauting, Germany) and Anton Steltenpohl (Munich).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional integrated circuit includes a first integrated circuit having a first transistor and a first buried oxide layer; a second integrated circuit having a second transistor and a second buried oxide layer; a bond interface between an upper surface of the first integrated circuit and an upper surface of the second integrated circuit; a passivation layer coupled to the first b...