US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Display module including bonding member connecting between light emitting diode and substrate" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,876, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Display module including bonding member connecting between light emitting diode and substrate" was invented by Seungryong Han (Suwon-si, South Korea), Yeonghyeon Seo (Suwon-si, South Korea), Sangmoo Park (Suwon-si, South Korea), Jinyoung Kim (Suwon-si, South Korea) and Byunghoon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A display module is provided. The display module includes: a substrate partitioned into a plurality of pixel regions and including a plurality of electrode pads disposed in the pixel regions; a bonding member i...