US Patent Issued to QUALCOMM on Nov. 3 for "Stacked integrated circuit devices" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,878, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego).

"Stacked integrated circuit devices" was invented by Yue Li (San Diego), Ryan Lane (San Diego), Yangyang Sun (San Diego), Charles David Paynter (Encinitas, Calif.) and Durodami Lisk (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked integrated circuit (IC) device includes a first die having a first face, a first active region adjacent to the first face, and first die-interconnect contacts disposed on the first face and connected to first circuitry. The stacked IC device includes a second die having a second face, a second active region adjacent to the second face, and ...