ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,843, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Taro Igoshi (Kariya-city, Ja... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,844, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of fabricating semiconduct... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,845, issued on Nov. 3, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China). "Manufacturing method for a die includ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,846, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Release film and method of manufacturing semic... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,847, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrating and accessing passive components in wafer-level packa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,848, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and semiconductor device" was invente... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,849, issued on Nov. 3. "Power semiconductor package" was invented by Geza Dezsi (Durham, N.C.) and Yusheng Lin (Phoenix). According to the ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,850, issued on Nov. 3, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Semiconductor power module and method for manufacturing a ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,851, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Laser assisted etching of dielectrics in IC devices" was invented... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,852, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method for manufactu... Read More