US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,852, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method for manufacturing the same" was invented by Jinyoung Kim (Suwon-si, South Korea), Wonbin Shin (Suwon-si, South Korea), Kiseok Kim (Suwon-si, South Korea) and Jihye Shim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first chip including a first substrate, a first wiring layer on the first substrate, and a plurality of through-electrodes to be connected to the first wiring layer and protruding from a lower surface of the first substrate, a double gap-fill layer covering...