US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Release film and method of manufacturing semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,846, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Release film and method of manufacturing semiconductor package using the same" was invented by Hansol Yoo (Sejong-si, South Korea) and Wonkeun Kim (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A release film may include a conductive polymer substrate layer, and release layers provided on a top surface and a bottom surface of the conductive polymer substrate layer. Each of the release layers may include a fluorine-based polymer, and a density of the conductive polymer substrate layer ranges from 0.1 g/cm3 to 0.5 g/cm3."

The patent ...