US Patent Issued to DENSO on Nov. 3 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,843, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device" was invented by Taro Igoshi (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lead frame, a semiconductor element, a clip, a sealing material, and a thermal resistance portion. The semiconductor element is mounted on the lead frame. The clip is bonded through a bonding material to an electrode on a surface of the semiconductor element opposite to the lead frame. The sealing material covers the semiconductor element and the clip. The thermal resistance portion is disposed in a bonding region bonded through ...