ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,849, issued on Nov. 3.
"Power semiconductor package" was invented by Geza Dezsi (Durham, N.C.) and Yusheng Lin (Phoenix).
According to the abstract* released by the U.S. Patent & Trademark Office: "Power semiconductor packages are provided. In one example, the power semiconductor package includes one or more semiconductor die having a wide bandgap semiconductor material, a housing, and one or more electrical leads extending from the housing. The power semiconductor package further includes a creepage cutout. In one example, the power semiconductor package further includes a creepage feature."
The patent was filed on Nov. 30, 2023, under Application No. 18/525,028.
*For further i...