US Patent Issued to HITACHI ENERGY on Nov. 3 for "Semiconductor power module and method for manufacturing a semiconductor power module" (Swiss Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,850, issued on Nov. 3, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland).

"Semiconductor power module and method for manufacturing a semiconductor power module" was invented by David Guillon (Vorderthal, Switzerland) and Fabian Mohn (Ennetbaden, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor power module for a semiconductor device comprises a leadframe or substrate and a resin body that is coupled to the leadframe or substrate. The resin body includes at least a first resin element and a second resin element, wherein a resin material of the first resin element is different from a resin material of the second resin e...