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US Patent Issued to SEMES on Nov. 3 for "Transport hand ring transport system using the same" (South Korean Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,712, issued on Nov. 3, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Transport hand ring transport system using the same" was i... Read More


US Patent Issued to Applied Materials Israel on Nov. 3 for "Hybrid vacuum electrostatic chuck carrier for high warpage wafers" (Israeli Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,713, issued on Nov. 3, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel). "Hybrid vacuum electrostatic chuck carrier for high ... Read More


US Patent Issued to Tokyo Electron on Nov. 3 for "Contactless wafer positioning carrier design" (Florida, Texas, New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,714, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Contactless wafer positioning carrier design" was invented by Henry Jim... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on Nov. 3 for "Wafer manufacturing system and method for manufacturing wafers" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,715, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC CHINA COMPANY Ltd. (Shangha... Read More


US Patent Issued to FUJI ELECTRIC on Nov. 3 for "Method of manufacturing semiconductor device by forming aluminum alloy film and removing possible defects in semiconductor chips" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,716, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Method of manufacturing semiconductor device by forming al... Read More


US Patent Issued to Applied Materials on Nov. 3 for "Influence function-based mitigation of substrate deformation with film deposition and ion implantation" (California, Massachusetts, Maine Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,717, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Influence function-based mitigation of substrate defor... Read More


US Patent Issued to Mitsubishi Electric on Nov. 3 for "Method of manufacturing semiconductor device and semiconductor manufacturing device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,718, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo). "Method of manufacturing semiconductor device and semiconductor ma... Read More


US Patent Issued to Tokyo Electron on Nov. 3 for "Substrate processing method and substrate processing apparatus using infrared spectroscopy with P-polarized infrared light" (New York Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,719, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus using in... Read More


US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Method and apparatus for wafer measurement" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,720, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method and apparatus for wafer measurement" was in... Read More


US Patent Issued to QUALCOMM on Nov. 3 for "Integrated device comprising elongated pads" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,721, issued on Nov. 3, was assigned to QUALCOMM Inc. (San Diego). "Integrated device comprising elongated pads" was invented by Yangyang Sun... Read More