US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Method and apparatus for wafer measurement" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,720, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Method and apparatus for wafer measurement" was invented by Ching-Chung Wang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus and a method for wafer measurement are provided. The method includes the steps of: generating a measurement program associated with a plurality of recipes; and controlling at least one measurement device, by executing the measurement program, to automatically measure a plurality of wafers according to the plurality of recipes."

The patent was filed on April 16, 2024, under Application No. 18/636,560. ...