US Patent Issued to Applied Materials Israel on Nov. 3 for "Hybrid vacuum electrostatic chuck carrier for high warpage wafers" (Israeli Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,713, issued on Nov. 3, was assigned to Applied Materials Israel Ltd. (Rehovot, Israel).

"Hybrid vacuum electrostatic chuck carrier for high warpage wafers" was invented by Ofer Dudovitch (Ganey Yohanan, Israel) and Yehuda Zur (Tel-Aviv, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate includes positioning the substrate on an upper surface of a modular substrate holder in a first chamber. The substrate holder comprises vacuum channels and electrodes. While within the first chamber, the substrate is clamped and flattened by applying a vacuum to the vacuum channels. A voltage is then applied to the electrodes to f...