US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC CHINA on Nov. 3 for "Wafer manufacturing system and method for manufacturing wafers" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,715, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC CHINA COMPANY Ltd. (Shanghai).

"Wafer manufacturing system and method for manufacturing wafers" was invented by Xiaoguang Li (Shanghai City, China), Yifei Zhang (Shanghai City, China) and Jinping Wu (Shanghai City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing wafers is provided, including: forming, according to a first control parameter, a first oxidation layer on each wafer of a first batch of wafers under a first atmospheric pressure; in response to receiving a process request corresponding to a second...