US Patent Issued to Mitsubishi Electric on Nov. 3 for "Method of manufacturing semiconductor device and semiconductor manufacturing device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,718, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Method of manufacturing semiconductor device and semiconductor manufacturing device" was invented by Kazutoshi Nakashima (Tokyo), Yuji Nojiri (Tokyo) and Takaya Noguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Acquired in a data acquisition process is a test result of an electrical test performed on a plurality of semiconductor chips. The test result is associated with arrangement information of the plurality of semiconductor chips. In a cutting process, a semiconductor wafer is cut based on a base point set in the semiconductor wafer. Identified in an identificat...