ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,843, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Taro Igoshi (Kariya-city, Ja... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,844, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of fabricating semiconduct... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,845, issued on Nov. 3, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China). "Manufacturing method for a die includ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,846, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Release film and method of manufacturing semic... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,847, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrating and accessing passive components in wafer-level packa... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,848, issued on Nov. 3, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and semiconductor device" was invente... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,849, issued on Nov. 3. "Power semiconductor package" was invented by Geza Dezsi (Durham, N.C.) and Yusheng Lin (Phoenix). According to the ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,850, issued on Nov. 3, was assigned to HITACHI ENERGY LTD (Zurich, Switzerland). "Semiconductor power module and method for manufacturing a ... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,851, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Laser assisted etching of dielectrics in IC devices" was invented... और पढ़ें
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,852, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method for manufactu... और पढ़ें