ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,758, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device having low d... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,759, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a reinforcing insu... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,760, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices with electrical... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,761, issued on Nov. 3, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "SiC-based electronic device with fuse element for... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,762, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architectures with heterogeneous integration of various d... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,763, issued on Nov. 3, was assigned to DENSO Corp. (Kariya, Japan). "Semiconductor module and power module including the same" was invented ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,764, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,765, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including heat sink structure an... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,766, issued on Nov. 3, was assigned to AMD DESIGN LLC (Wilmington, Del.). "Heat sink with heat pipe handle portion" was invented by Sruti Ch... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,767, issued on Nov. 3, was assigned to DENSO International America Inc. (Southfield, Mich.) and DENSO Corp. (Kariya-city, Japan). "Emitters ... Read More