US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Semiconductor devices with electrical fuses and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,760, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices with electrical fuses and methods of fabricating the same" was invented by Chia-Chung Chen (Hsinchu, Taiwan), Meng-Sheng Chang (Hsinchu, Taiwan), Chung-Sheng Yuan (Hsinchu, Taiwan) and Yi-Kan Cheng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate having a first surface and a second surface opposite the first surface. The semiconductor structure includes a semiconductor device disposed on the first surface. The semiconductor structure includes a metallization layer di...