US Patent Issued to Intel on Nov. 3 for "Package architectures with heterogeneous integration of various device thicknesses" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,762, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package architectures with heterogeneous integration of various device thicknesses" was invented by Gang Duan (Chandler, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Brandon Marin (Gilbert, Ariz.), Suddhasattwa Nad (Chandler, Ariz.), Jeremy Ecton (Gilbert, Ariz.), Yang Wu (Chandler, Ariz.), Minglu Liu (Chandler, Ariz.) and Yosuke Kanaoka (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic integrated circuit package structures include a first die and a second die both coupled to a bridge structure at an interface. A first thermally conductive mold...