US Patent Issued to DENSO on Nov. 3 for "Semiconductor module and power module including the same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,763, issued on Nov. 3, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor module and power module including the same" was invented by Yuu Yamahira (Kariya-city, Japan) and Masashi Masumoto (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first semiconductor component having a first semiconductor chip and a first heat sink and a second semiconductor component having a second semiconductor chip and a second heat sink are disposed in a cooler. The first semiconductor chip is smaller in size than the second semiconductor chip. A first heat conduction surface between the first semiconductor chip and the first heat sink is smal...