ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,764, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan).
"Electronic package and manufacturing method thereof" was invented by Yu-Lung Huang (Taichung City, Taiwan), Chih-Ming Huang (Taichung City, Taiwan), Kuo-Hua Yu (Taichung City, Taiwan) and Chang-Fu Lin (Taichung City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in t...