US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor device having a reinforcing insulating layer corresponding to a via" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,759, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device having a reinforcing insulating layer corresponding to a via" was invented by Kyoungpil Park (Suwon-si, South Korea), Doohwan Park (Suwon-si, South Korea), Sanghyun Lee (Suwon-si, South Korea) and Hyeonmin Jeon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first wiring level layer including a lower wiring layer, a second wiring level layer on the first wiring level layer and including an upper wiring layer, a via level layer positioned between the first wiring level layer and the ...