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US Patent Issued to Applied Materials on Aug. 4 for "Radical plasma treatment for semiconductor metal gate stack" (California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,938, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Radical plasma treatment for semiconductor metal gate ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Semiconductor packages and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,939, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor packages and methods of... Read More


US Patent Issued to Beijing BOE Technology Development, BOE Technology Group on Aug. 4 for "Metal wires and methods for manufacturing the same" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,940, issued on Aug. 4, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing). "M... Read More


US Patent Issued to International Business Machines on Aug. 4 for "Method and structure to form connector tabs in subtractive patterning" (New York Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,941, issued on Aug. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Method and structure to form connector tabs in... Read More


US Patent Issued to DISCO on Aug. 4 for "Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,942, issued on Aug. 4, was assigned to DISCO Corp. (Tokyo). "Wafer processing apparatus providing cleaning and etching units with separate s... Read More


US Patent Issued to CENTRAL GLASS on Aug. 4 for "Surface treatment method for semiconductor substrates and surface treatment agent composition" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,943, issued on Aug. 4, was assigned to CENTRAL GLASS COMPANY Ltd. (Ube, Japan). "Surface treatment method for semiconductor substrates and s... Read More


US Patent Issued to Lam Research on Aug. 4 for "Modular-component system for gas delivery" (Oregon, California Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,944, issued on Aug. 4, was assigned to Lam Research Corp. (Fremont, Calif.). "Modular-component system for gas delivery" was invented by Joh... Read More


US Patent Issued to SEMES on Aug. 4 for "Substrate processing apparatus and method of controlling the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,945, issued on Aug. 4, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Substrate processing apparatus and method of controlling t... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Buffing cleaning apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,946, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Buffing cleaning apparatus" was invented by In... Read More


US Patent Issued to EBARA on Aug. 4 for "Substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,947, issued on Aug. 4, was assigned to EBARA Corp. (Tokyo). "Substrate processing apparatus" was invented by Mitsuru Miyazaki (Tokyo), Hiros... Read More