US Patent Issued to DISCO on Aug. 4 for "Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,942, issued on Aug. 4, was assigned to DISCO Corp. (Tokyo).

"Wafer processing apparatus providing cleaning and etching units with separate shrouds and enclosing separate spinner tables" was invented by Akihito Kawai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing apparatus includes a chuck table for holding the wafer thereon, a grinding unit having a rotatable grinding wheel with an annular array of grindstones mounted thereon for grinding a surface of the wafer, a cleaning unit for cleaning the wafer that has been ground, and an etching unit for removing a strain from the ground surface of the wafer. The grinding wheel is sm...