US Patent Issued to EBARA on Aug. 4 for "Substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,947, issued on Aug. 4, was assigned to EBARA Corp. (Tokyo).

"Substrate processing apparatus" was invented by Mitsuru Miyazaki (Tokyo), Hiroshi Sotozaki (Tokyo), Hiroki Miyamoto (Tokyo), Kenichi Takebuchi (Tokyo), Saki Miyagawa (Tokyo), Hiroki Saito (Tokyo), Takuya Inoue (Tokyo), Shozo Takahashi (Tokyo) and Ryohei Ishii (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus that can quickly transport a polished substrate (e.g., a wafer) to a cleaning module is disclosed. A first processing unit includes: a polishing module configured to polish the substrate W; a cleaning module configured to clean the substrate W; a dry...