ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,943, issued on Aug. 4, was assigned to CENTRAL GLASS COMPANY Ltd. (Ube, Japan).

"Surface treatment method for semiconductor substrates and surface treatment agent composition" was invented by Yuzo Okumura (Ube, Japan), Yuki Fukui (Ube, Japan), Saori Shiota (Ube, Japan), Yoshiharu Terui (Ube, Japan) and Soichi Kumon (Ube, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface treatment method for semiconductor substrates of the present invention is a treatment method of treating a main surface of a semiconductor substrate that has, on the main surface of the substrate, a pattern formation region in which a pattern having a concave-convex struc...