ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,969, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of semiconduct... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,970, issued on Aug. 11, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device having metal member with bonding member rec... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,971, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Transistor-scale thermoelectric devices for refrigeration of in... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,972, issued on Aug. 11, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Heterogeneously integrated liquid electrolyte... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,973, issued on Aug. 11, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Power module" was invented by Shian-Ch... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,974, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor package with a scratch protecti... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,975, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan). "Wafer level multi-die structure form... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,976, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Structures and methods for reducing... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,977, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,978, issued on Aug. 11, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Memory device and fabricating method thereof" wa... Read More