US Patent Issued to DENSO on Aug. 11 for "Semiconductor device having metal member with bonding member receiving space" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,970, issued on Aug. 11, was assigned to DENSO Corp. (Kariya-city, Japan).

"Semiconductor device having metal member with bonding member receiving space" was invented by Shingo Tsuchimochi (Kariya-city, Japan), Hirotoshi Kusama (Kariya-city, Japan) and Takanori Kawashima (Kariya-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor element having main electrodes on opposite faces in a plate thickness direction; a substrate having an insulating base member, a front-face metal body disposed on a front face of the insulating base member and electrically connected to one of the main electrodes of the ...