ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,973, issued on Aug. 11, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).
"Power module" was invented by Shian-Chiau Chiou (Miaoli County, Taiwan), Chun-Kai Liu (Hsinchu City, Taiwan), Po-Kai Chiu (Taoyuan City, Taiwan), Chih-Ming Tzeng (Hsinchu City, Taiwan) and Yao-Shun Chen (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is elect...