US Patent Issued to Infineon Technologies Austria on Aug. 11 for "Semiconductor package with a scratch protection layer and method of fabrication" (German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,974, issued on Aug. 11, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package with a scratch protection layer and method of fabrication" was invented by Frank Singer (Regenstauf, Germany) and Martin Mayer (Nittendorf, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a carrier having a first side and an opposing second side; a semiconductor die arranged on the first side of the carrier; a heat conductor part arranged on the second side of the carrier; an encapsulation body encapsulating the semiconductor die, wherein the heat conductor part is exposed from the encapsulation...