US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 11 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,977, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Der-Chyang Yeh (Hsinchu, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Yu-Hsiung Wang (Zhubei, Taiwan), Chao-Wen Shih (Zhubei, Taiwan), Sung-Feng Yeh (Taipei, Taiwan), Ta Hao Sung (Hsinchu, Taiwan), Cheng-Wei Huang (Hsinchu, Taiwan), Yen-Ping Wang (Hemei Township, Taiwan), Chang-Wen Huang (Hsinchu, Taiwan), Sheng-Ta Lin (Gongguan Township, Taiwan), Li-Cheng Hu (Hsinchu, Taiwan) and Gao-Long Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments inclu...