US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Wafer level multi-die structure formation" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,975, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD (Hsinchu, Taiwan).

"Wafer level multi-die structure formation" was invented by Shan-Yu Huang (Zhubei city, Taiwan), Shih-Chang Chen (Chiayi County, Taiwan), Yilun Chen (Hsinchu, Taiwan) and Huang-Sheng Lin (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An array of dies is formed over a substrate. Each of the dies contains a plurality of functional transistors. A plurality of first seal rings each surround a respective one of the dies in a top view. The first seal rings define a plurality of corner regions that are disposed outside of the first seal r...