ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,241, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Sangw... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,242, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,243, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Ji Hy... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,244, issued on Aug. 25, was assigned to Volantis Semiconductor Inc. (Portland, Ore.). "Wafer-scale integration with a stiffening isometric ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,245, issued on Aug. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Power semiconductor device" was invented by R... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,247, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Shigeru Hirata (Kyoto, Japan).... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,248, issued on Aug. 25, was assigned to Commissariat a l'Energie Atomique et aux Energies Alternatives (Paris). "Method of assembly by dire... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,792, issued on Aug. 25, was assigned to INNOSCIENCE (SUZHOU) TECHNOLOGY Co. LTD. (Suzhou City, China). "Nitride-based semiconductor device ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,793, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Single process double gate and variable thre... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,794, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods o... Read More