ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,247, issued on Aug. 25, was assigned to Rohm Co. Ltd. (Kyoto, Japan).
"Semiconductor device" was invented by Shigeru Hirata (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: an IC; a first lead having an island portion to which the IC is bonded; a second lead having a band-shaped portion; a plurality of additional leads spaced apart from the second lead with the first lead therebetween, and electrically connected to the IC; and a plurality of wires bonded to the IC and the plurality of additional leads. As viewed in the thickness direction, each of the additional leads has an edge facing the island portion...