ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,241, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Sangwook Park (Suwon-si, South Korea), Sangkyu Kim (Suwon-si, South Korea), Yoonseok Seo (Suwon-si, South Korea) and Sangnam Jeong (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base substrate, and a first package and a second package mounted apart from each other on an upper surface of the base substrate in a horizontal directions. The second package includes, on each surface thereof, connection pads corresponding to a package ball map including cells, arrange...