US Patent Issued to NXP on Sept. 29 for "FinFET with local heatsinking and method of manufacturing the same" (Texas, California Inventors)

पोस्टेड ऑन: 2026-09-30

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,286, issued on Sept. 29, was assigned to NXP B.V. (Eindhoven, Netherlands). "FinFET with local heatsinking and method of manufacturing the... और पढ़ें

US Patent Issued to ROHM on Sept. 29 for "Nitride semiconductor device with embedded metal in trench of substrate" (Japanese Inventor)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,287, issued on Sept. 29, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Nitride semiconductor device with embedded metal in trench of subs... और पढ़ें

US Patent Issued to Marvel Asia on Sept. 29 for "Three-dimensional device package with carrier substrate and thermal vias" (Maine, Vermont, North Carolina Inventors)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,288, issued on Sept. 29, was assigned to Marvel Asia Pte Ltd (Singapore). "Three-dimensional device package with carrier substrate and the... और पढ़ें

US Patent Issued to ND-HI TECHNOLOGIES LAB, ETRON TECHNOLOGY on Sept. 29 for "Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the same" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,289, issued on Sept. 29, was assigned to ND-HI TECHNOLOGIES LAB INC. and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "Semiconductor package a... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Devices with through silicon vias, guard rings and methods of making the same" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,290, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Devices with through silicon vias... और पढ़ें

US Patent Issued to Sandisk Technologies on Sept. 29 for "Semiconductor structures including auxetic microstructures and method of forming the same" (Japanese Inventor)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,291, issued on Sept. 29, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Semiconductor structures including auxetic microst... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Package structure including ring structure attached by hybrid adhesive and methods of forming the same" (Taiwanese Inventors)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,292, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including ring ... और पढ़ें

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 29 for "Package structure with transmission line and method for manufacturing the same" (Taiwanese Inventor)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,293, issued on Sept. 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Package structure with transm... और पढ़ें

US Patent Issued to DIODES on Sept. 29 for "Lead frame with a tie bar having branch part" (Chinese Inventors)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,294, issued on Sept. 29, was assigned to DIODES Inc. (Plano, Texas). "Lead frame with a tie bar having branch part" was invented by Xiaoru... और पढ़ें

US Patent Issued to Rohm on Sept. 29 for "Semiconductor device" (Japanese Inventor)

पोस्टेड ऑन: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,295, issued on Sept. 29, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Masaki Kano (Kyoto, Japan). ... और पढ़ें

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US Patent Issued to NXP on Sept. 29 for "FinFET with local heatsinking and method of manufacturing the same" (Texas, California Inventors)

US Patent Issued to ROHM on Sept. 29 for "Nitride semiconductor device with embedded metal in trench of substrate" (Japanese Inventor)

US Patent Issued to Marvel Asia on Sept. 29 for "Three-dimensional device package with carrier substrate and thermal vias" (Maine, Vermont, North Carolina Inventors)

US Patent Issued to ND-HI TECHNOLOGIES LAB, ETRON TECHNOLOGY on Sept. 29 for "Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the same" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Devices with through silicon vias, guard rings and methods of making the same" (Taiwanese Inventors)

US Patent Issued to Sandisk Technologies on Sept. 29 for "Semiconductor structures including auxetic microstructures and method of forming the same" (Japanese Inventor)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Package structure including ring structure attached by hybrid adhesive and methods of forming the same" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 29 for "Package structure with transmission line and method for manufacturing the same" (Taiwanese Inventor)

US Patent Issued to DIODES on Sept. 29 for "Lead frame with a tie bar having branch part" (Chinese Inventors)

US Patent Issued to Rohm on Sept. 29 for "Semiconductor device" (Japanese Inventor)