US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Devices with through silicon vias, guard rings and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,290, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Devices with through silicon vias, guard rings and methods of making the same" was invented by Min-Feng Ku (Hsinchu, Taiwan), Yao-Chun Chuang (Hsinchu, Taiwan), Ching-Pin Lin (Hsinchu, Taiwan) and Cheng-Chien Li (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor article which includes a semiconductor substrate, a back end of the line (BEOL) wiring portion on the semiconductor substrate, a through silicon via and a guard ring. The semiconductor substrate is made of a semiconductor material. The BEOL wiring portion inc...