US Patent Issued to Marvel Asia on Sept. 29 for "Three-dimensional device package with carrier substrate and thermal vias" (Maine, Vermont, North Carolina Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,288, issued on Sept. 29, was assigned to Marvel Asia Pte Ltd (Singapore).

"Three-dimensional device package with carrier substrate and thermal vias" was invented by Janak Patel (South Burlington, Vt.), Richard S Graf (Gray, Maine) and David M. Bond (Apex, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes: (a) a die, including: a first surface having electronic components formed thereon, a second surface opposite the first surface, and first thermal vias (TVs) traversing through the die between the first and second surfaces, the first TVs being: arranged in a first layout, and configured to dissipate heat generated by...