US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 29 for "Package structure with transmission line and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,293, issued on Sept. 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with transmission line and method for manufacturing the same" was invented by Wen-Shiang Liao (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a formation method are provided. The package structure includes a chip structure bonded to a substrate through dielectric-to-dielectric bonding and metal-to-metal bonding and interconnect dielectric layers formed over the chip structure. The package structure further includes interconnect conductive structures formed in the interconnect di...