US Patent Issued to ND-HI TECHNOLOGIES LAB, ETRON TECHNOLOGY on Sept. 29 for "Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,289, issued on Sept. 29, was assigned to ND-HI TECHNOLOGIES LAB INC. and ETRON TECHNOLOGY INC. (Hsinchu, Taiwan).

"Semiconductor package and semiconductor package assembly with edge interconnection and method of forming the same" was invented by Ho-Ming Tong (Taipei City, Taiwan) and Chao-Chun Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An IC stack includes: a plurality of integrated circuit (IC) structure horizontally separate with each other, wherein each IC structure comprises a top surface, a bottom surface opposite to the top surface, and four sidewalls with a first sidewall, a second sidewall, a third sidewall and a fou...