US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Package structure including ring structure attached by hybrid adhesive and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,292, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including ring structure attached by hybrid adhesive and methods of forming the same" was invented by Wen-Yi Lin (New Taipei City, Taiwan), Yi-Che Chiang (Hsinchu, Taiwan), Chien-Chen Li (Hsinchu, Taiwan), Chien-Li Kuo (Hsinchu City, Taiwan) and Kuo-Chio Liu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a package substrate, a semiconductor die module on the package substrate, a ring structure on the package substrate adjacent to the semiconductor die module, and a hybrid adhes...