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US Patent Issued to SHENZHEN UNIVERSITY on May 12 for "Threshold switching material, threshold switching device and preparation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,352, issued on May 12, was assigned to SHENZHEN UNIVERSITY (Shenzhen, China). "Threshold switching material, threshold switching device and ... Read More


US Patent Issued to Advanced Semiconductor Engineering on May 12 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,353, issued on May 12, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Package structure" was invented by Hai-... Read More


US Patent Issued to QUALCOMM on May 12 for "Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,354, issued on May 12, was assigned to QUALCOMM Inc. (San Diego). "Package dies including vertical interconnects for signal and power distri... Read More


US Patent Issued to NANYA TECHNOLOGY on May 12 for "Capacitor structure and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,355, issued on May 12, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Capacitor structure and method for fabricating the... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Multi-lateral recessed MIM structure" (Taiwanese, American Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,356, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Multi-lateral recessed MIM structure"... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Ferromagnetic plates for enhancing inductance and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,357, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Ferromagnetic plates for enhancing in... Read More


US Patent Issued to QUALCOMM on May 12 for "Vertically integrated device stack including system on chip and power management integrated circuit" (Washington, California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,358, issued on May 12, was assigned to QUALCOMM Inc. (San Diego). "Vertically integrated device stack including system on chip and power man... Read More


US Patent Issued to DB HiTek on May 12 for "Deep trench capacitor and method of manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,359, issued on May 12, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea). "Deep trench capacitor and method of manufacturing same"... Read More


US Patent Issued to Murata Manufacturing on May 12 for "Semiconductor device with protective protrusion" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,360, issued on May 12, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Semiconductor device with protective protrusion" was i... Read More


US Patent Issued to SAMSUNG ELECTRONICS on May 12 for "Dielectric having high-dielectric constant, method of manufacturing the same, target material for manufacturing the dielectric, electronic device including the dielectric, and electronic apparatus including the electronic device" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,361, issued on May 12, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Dielectric having high-dielectric constant,... Read More