US Patent Issued to QUALCOMM on May 12 for "Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,354, issued on May 12, was assigned to QUALCOMM Inc. (San Diego).

"Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3D) integrated circuit (IC) package" was invented by Mustafa Badaroglu (San Diego) and Zhongze Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D IC package includes a first package die having a first side coupled to a package substrate and a second side coupled to a second package die. The first package die includes vertical interconnects to provide interconnections between the second package die and the package substrate. The vertical interconnects each extend ver...