US Patent Issued to Nexperia Technology (Shanghai), Nexperia on July 14 for "Semiconductor device including trench gate and source open end and manufacturing method thereof" (Chinese Inventors)

Posted On: 2026-07-14

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,811, issued on July 14, was assigned to Nexperia Technology (Shanghai) Ltd. (Shanghai) and Nexperia B.V. (NiJmegen, Netherlands). "Semicond... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Methods for fabricating semiconductor device having nanostructure transistor with cap layer" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,812, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Methods for fabricating semicon... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Vertical gate-all-around device" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,813, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Vertical gate-all-around device... Read More

US Patent Issued to Micron Technology on July 14 for "Apparatus and electronic devices including transistors comprising two-dimensional materials" (California, Idaho Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,814, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho). "Apparatus and electronic devices including transistors comp... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Device having extended source/drain contact and method" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,815, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Device having extended source/drain... Read More

US Patent Issued to International Business Machines on July 14 for "Reduced gate top CD with wrap-around gate contact" (New York Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,816, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Reduced gate top CD with wrap-around gate co... Read More

US Patent Issued to International Business Machines on July 14 for "Spacer cut for asymmetric source/drain epitaxial structure in stacked FET" (New York Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,817, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Spacer cut for asymmetric source/drain epita... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor device and method for manufacturing thereof" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,818, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and method... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Air liner for through substrate via" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,819, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Air liner for through substrate... Read More

US Patent Issued to Semiconductor Manufacturing International (Shanghai), Semiconductor Manufacturing International (Beijing) on July 14 for "Semiconductor structure and fabrication method thereof" (Chinese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,820, issued on July 14, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai) and Semiconductor Manufacturin... Read More

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US Patent Issued to Nexperia Technology (Shanghai), Nexperia on July 14 for "Semiconductor device including trench gate and source open end and manufacturing method thereof" (Chinese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Methods for fabricating semiconductor device having nanostructure transistor with cap layer" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Vertical gate-all-around device" (Taiwanese Inventors)

US Patent Issued to Micron Technology on July 14 for "Apparatus and electronic devices including transistors comprising two-dimensional materials" (California, Idaho Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Device having extended source/drain contact and method" (Taiwanese Inventors)

US Patent Issued to International Business Machines on July 14 for "Reduced gate top CD with wrap-around gate contact" (New York Inventors)

US Patent Issued to International Business Machines on July 14 for "Spacer cut for asymmetric source/drain epitaxial structure in stacked FET" (New York Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Semiconductor device and method for manufacturing thereof" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Air liner for through substrate via" (Taiwanese Inventors)

US Patent Issued to Semiconductor Manufacturing International (Shanghai), Semiconductor Manufacturing International (Beijing) on July 14 for "Semiconductor structure and fabrication method thereof" (Chinese Inventors)