US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Air liner for through substrate via" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,819, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Air liner for through substrate via" was invented by Kuan-Hsun Wang (Hsinchu City, Taiwan), Tsung-Chieh Hsiao (Changhua County, Taiwan), Chih Hsin Yang (Hsinchu County, Taiwan), Liang-Wei Wang (Hsinchu City, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first conductive pad disposed over a first side of a substrate in a first direction. A second conductive pad is disposed over a second side of the substrate in the first direction. A through-substrate via (TSV) extends into the substrate in the firs...