ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,469, issued on July 21, was assigned to NXP USA Inc. (Austin, Texas). "Packaged semiconductor device, leadframe and method for improved bon... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,470, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit package with multiple interconnects" was inven... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,471, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device for upper and lower arm circuits" was inven... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,472, issued on July 21, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China). "Package structure assembly for TVS devices... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,473, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having dummy pads and ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,474, issued on July 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring substrate, semiconductor device, and m... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,475, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Lithography pillar process for embedded bridge scaling" was inv... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,476, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device package and me... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,477, issued on July 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring substrate, semiconductor device, and m... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,478, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having semiconductor c... Read More