US Patent Issued to SHINKO ELECTRIC INDUSTRIES on July 21 for "Wiring substrate, semiconductor device, and method of manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,474, issued on July 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Wiring substrate, semiconductor device, and method of manufacturing wiring substrate" was invented by Shota Miki (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate has a first wiring substrate, plurality of second wiring substrates, and an adhesive layer. The plurality of second wiring substrates are arranged adjacent to each other on the first wiring substrate. The adhesive layer adheres the first wiring substrate and the plurality of second wiring substrates to each other. The adhesive layer has a filling portion that fills a...