ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,475, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).
"Lithography pillar process for embedded bridge scaling" was invented by Kyle McElhinny (Tempe, Ariz.), Haobo Chen (Gilbert, Ariz.), Hongxia Feng (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.) and Leonel Arana (Phoenix).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate, and a first pad over the package substrate. In an embodiment, a layer is over the package substrate, where the layer is an insulating material. In an embodiment, the electronic packag...