US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,473, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads" was invented by Young Kun Jee (Cheonan-si, South Korea), Hae-Jung Yu (Seoul, South Korea), Sangwon Kim (Asan-si, South Korea), Un-Byoung Kang (Hwaseong-si, South Korea), Jongho Lee (Hwaseong-si, South Korea), Dae-Woo Kim (Seongnam-si, South Korea) and Wonjae Lee (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a plurality of package terminals disposed on the bottom surface o...