US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package having semiconductor chip on wiring layers and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,478, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having semiconductor chip on wiring layers and method of fabricating the same" was invented by Myungsam Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes stacked wiring layers, a lower substrate pad on a bottom surface of a lowermost wiring layer, a protection layer covering the lower substrate pad on the bottom surface of the lowermost wiring layer, a dielectric layer on a top surface of an uppermost wiring layer, an upper substrate pad on the dielectric layer, a semiconductor...